KINGYOUP Laser Debonding System - Kingyoup Enterprises Co., Ltd.
Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package - ScienceDirect
Addressing 3D IC Assembly Challenges at IMAPS DPC 2015 | 3D InCites
BrewerBOND® T1100/C1300 Series Materials - Brewer Science
PRODUCTS Laser Debonding Lab kit | Optopia
Morphological, optical, and elemental analysis of dental enamel afte
The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics | Semantic Scholar
US20160133486A1 - Double Layer Release Temporary Bond and Debond Processes and Systems - Google Patents